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Strategic Refinancing and New Equity Issuance Support Wolfspeed's Long-term Growth Potential

DURHAM, N.C.--(BUSINESS WIRE)--Wolfspeed, Inc. (NYSE: WOLF) (“Wolfspeed” or the “Company”), a global leader in silicon carbide technology, today announced the closing of its previously announced private placements of convertible notes, common stock, and pre-funded warrants (the “Private Placements”). In connection with the Private Placements, the Company redeemed approximately $475.9 million of the Company's outstanding Senior Secured Notes due 2030 (the “Senior Secured Notes”), which is expect.

Wolfspeed Announces Subscriptions for $379 Million of Convertible Notes and $96.9 Million of Common Stock and Pre-Funded Warrants

DURHAM, N.C.--(BUSINESS WIRE)--Wolfspeed, Inc. (NYSE: WOLF) (“Wolfspeed”) today announced that on March 19, 2026, it entered into separate, privately negotiated subscription agreements with investors pursuant to which Wolfspeed will place (i) $379,000,000 aggregate principal amount of its 3.5% Convertible 1.5 Lien Senior Secured Notes due 2031 (the “Notes”) and (ii) 3,250,030 shares of common stock, at a purchase price of $18.458 per share (the “Shares”) and pre-funded warrants (the “Pre-Funded.

Wolfspeed Appoints Silicon Carbide Industry Veteran Daihui Yu as Regional President, Greater China

DURHAM, N.C.--(BUSINESS WIRE)--Wolfspeed is pleased to announce the appointment of Daihui Yu as regional president for Greater China, effective March 16, 2026. In this key leadership position, Yu will oversee the expansion of the company's business across mainland China, Hong Kong and Taiwan, utilizing his substantial expertise to drive sales growth and strengthen our brand presence in the region. Yu holds a degree in electrical engineering from Wuhan University of Technology and an MBA from Ts.

Wolfspeed Unveils Foundation for Next‑Generation AI Data Center Advanced Packaging Leveraging 300mm Silicon Carbide Technology

DURHAM, N.C.--(BUSINESS WIRE)--Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade. “As AI workloads continue to increase package size, power density, and integration complexity, we believe new materials foundations will be increasingly important to.