Qnity Electronics, Inc. (Q)

NYQ – Цена в реальном времени. Валюта: USD

158.20

-9.29 (-5.55%)

При закрытии: Jun 26, 2026, 4:05 PM EDT

157.00

-1.20 (-0.76%)

После закрытия: Jun 26, 2026, 7:59 PM EDT

16.06.2026

Qnity Electronics, Inc. (Q) Presents at 3rd Annual Materials of the Future Conference Transcript

12.06.2026

Qnity to Present at the Wolfe Research Materials of the Future Conference

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity's Chief Executive Officer, will participate in a fireside chat at the Wolfe Research 3rd Annual Materials of the Future Conference on June 16, 2026, at 8:35 a.m. ET. A live webcast of the fireside chat will be available at Events | Qnity Electronics, Inc. (Q). A replay of the webcast will be available fol.

10.06.2026

Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads. As semiconductor devices continue to shrink and increase in complexity, diverse CMP processes are critical to achieving the precision required for reliable device performance. Optivision™ Max CMP.

08.06.2026

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate str.

28.05.2026

Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced it received the 2025 ASE Best Supplier Award from ASE Technology Holding Co., Ltd., one of the world's largest outsourced semiconductor assembly and test providers (OSATs), headquartered in Taiwan, for its silicone-based materials. An honor bestowed on ASE partners, the annual award recognizes those who provide outstanding pe.

14.05.2026

Qnity Electronics Q1 Earnings Call Highlights

Qnity Electronics NYSE: Q reported a record first quarter for fiscal 2026, with management citing strong demand tied to artificial intelligence, high-performance computing and advanced connectivity as key drivers of growth across both of its business segments.

13.05.2026

These Analysts Boost Their Forecasts On Qnity Electronics After Better-Than-Expected Q1 Results

Qnity Electronics Inc (NYSE:Q) on Tuesday delivered a stronger‑than‑expected fiscal first quarter and boosted its full‑year 2026 outlook.

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27.02.2026

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CNBC's Jim Cramer on why Corning and Qnity are 'pleasant surprises'

03.11.2025

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Qnity CEO: Advanced chip packaging is powering the next wave of wearables

Пресс-релизы

10.06.2026

Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads. As semiconductor devices continue to shrink and increase in complexity, diverse CMP processes are critical to achieving the precision required for reliable device performance. Optivision™ Max CMP.

08.06.2026

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

28.05.2026

Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced it received the 2025 ASE Best Supplier Award from ASE Technology Holding Co., Ltd., one of the world's largest outsourced semiconductor assembly and test providers (OSATs), headquartered in Taiwan, for its silicone-based materials. An honor bestowed on ASE partners, the annual award recognizes those who provide outstanding pe.

12.05.2026

Qnity Reports First Quarter 2026 Results, Raises Full-Year Financial Guidance

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q) today reported results for the first quarter ended March 31, 2026. “Qnity had a tremendous start to the year, outperforming our expectations and delivering our eighth consecutive quarter of strong profitable organic growth with double-digit gains in both segments,” said Jon Kemp, Qnity's Chief Executive Officer. “These results reflect the strength of our integrated portfolio – spanning advanced chips, advanced packag.

Qnity Electronics, Inc. (Q)

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Qnity Electronics, Inc. (Q)

Qnity Electronics, Inc. (Q) Presents at 3rd Annual Materials of the Future Conference Transcript

Qnity to Present at the Wolfe Research Materials of the Future Conference

Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials

Qnity Electronics Q1 Earnings Call Highlights

These Analysts Boost Their Forecasts On Qnity Electronics After Better-Than-Expected Q1 Results

Видео

Пресс-релизы

Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials

Qnity Reports First Quarter 2026 Results, Raises Full-Year Financial Guidance

Qnity Electronics, Inc. (Q) Presents at 3rd Annual Materials of the Future Conference Transcript

Qnity to Present at the Wolfe Research Materials of the Future Conference

Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials

Qnity Electronics Q1 Earnings Call Highlights

These Analysts Boost Their Forecasts On Qnity Electronics After Better-Than-Expected Q1 Results

Видео

Пресс-релизы

Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials

Qnity Reports First Quarter 2026 Results, Raises Full-Year Financial Guidance

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Qnity Electronics, Inc. (Q)

Получите доступ ко всем премиум-функциям лучшего инструмента для анализа акций

Finranks

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Мы в соцсетях

Qnity Electronics, Inc. (Q)

Qnity Electronics, Inc. (Q) Presents at 3rd Annual Materials of the Future Conference Transcript

Qnity to Present at the Wolfe Research Materials of the Future Conference

Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials

Qnity Electronics Q1 Earnings Call Highlights

These Analysts Boost Their Forecasts On Qnity Electronics After Better-Than-Expected Q1 Results

Видео

Пресс-релизы

Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials

Qnity Reports First Quarter 2026 Results, Raises Full-Year Financial Guidance

Qnity Electronics, Inc. (Q) Presents at 3rd Annual Materials of the Future Conference Transcript

Qnity to Present at the Wolfe Research Materials of the Future Conference

Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials

Qnity Electronics Q1 Earnings Call Highlights

These Analysts Boost Their Forecasts On Qnity Electronics After Better-Than-Expected Q1 Results

Видео

Пресс-релизы

Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials

Qnity Reports First Quarter 2026 Results, Raises Full-Year Financial Guidance