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3 E Network CEO Continues to Increase His Stake, Reflecting Confidence in the Company's AI Strategy and Operational Results

HONG KONG, Sept. 03, 2026 (GLOBE NEWSWIRE) -- 3 E Network Technology Group Limited (Nasdaq: MASK) (the “Company” or “3 E Network”), a business-to-business (“B2B”) information technology (“IT”) business solutions provider, committed to becoming a next-generation artificial intelligence (“AI”) infrastructure solutions provider, today announced that it has entered into a securities purchase agreement with an entity controlled by its Chief Executive Officer, Dr. Tingjun Yang.

3 E Network Enters into $1M Private Placement to CEO-Led Entity at $1.426 Per Share

HONG KONG, Sept. 02, 2026 (GLOBE NEWSWIRE) -- 3 E Network Technology Group Limited (Nasdaq: MASK) (the “Company” or “3 E Network”) entered into a subscription agreement (the “Subscription Agreement”) with 3E NETWORK TECHNOLOGY PTE.

3 E Network Secures $1.2 Million Enterprise DDR4 Memory Sales Order

HONG KONG, Sept. 01, 2026 (GLOBE NEWSWIRE) -- 3 E Network Technology Group Limited (Nasdaq: MASK) (the “Company” or “3 E Network”), a business-to-business (“B2B”) information technology (“IT”) business solutions provider, committed to becoming a next-generation artificial intelligence (“AI”) infrastructure solutions provider, today announced that its wholly owned subsidiary, 3e Network Technology Company Limited (“HK 3e Network”), has entered into a hardware sales agreement with an enterprise client.

3 E Network Establishes AI Storage Controller Architecture and Validates Core Data Flow Algorithms

HONG KONG, Aug. 12, 2026 (GLOBE NEWSWIRE) -- 3 E Network Technology Group Limited (Nasdaq: MASK) (the “Company” or “3 E Network”), a business-to-business (“B2B”) information technology (“IT”) business solutions provider, committed to becoming a next-generation artificial intelligence (“AI”) infrastructure solutions provider, today announced a significant milestone in its semiconductor technology R&D. Following the recent official establishment of its Chip Business Unit (“CBU”), the Company announced that its next-generation customized storage controller, designed to address the concurrent data throughput demands of AI large models, has successfully completed the initial system-level architecture specification.